19. Jan 2026

The American Chemistry Council’s Center for the Polyurethane Industry’s annual Polyurethane Technical Conference will this year be held in Orlando, Florida.
With less than one month remaining before the submission deadline, organisers of CPI’s 2026 Polyurethanes Technical Conference are urging researchers, developers and technical specialists to submit abstracts for papers and posters.
All abstracts must be submitted by 17 February 2026, ahead of the conference, which will take place on 5–7 October 2026 in Orlando, Florida.
Regarded as one of the leading technical forums for the global polyurethanes industry, the Polyurethanes Technical Conference brings together several hundred professionals from across the value chain to share research, present innovations and discuss emerging challenges and opportunities in polyurethane materials and processing.
Successful authors will have the opportunity to present their work to an international technical audience and have their papers published in the official conference proceedings, providing visibility among industry peers, end-users and trade media. The event also includes an awards programme, with best paper and best poster winners announced during the Conference Award Luncheon. Submissions are assessed by a panel of technical and industry experts based on technical merit and presentation quality.
The call for papers spans a broad range of topics, including applications such as automotive, construction, appliances, medical, packaging and furnishings; product areas including flexible and rigid foams, thermoplastic polyurethanes, adhesives, coatings and elastomers; and chemistry-focused themes such as diisocyanates, biobased and recycled content materials, blowing agents and additives. Processing innovations, digitalisation, 3D printing, sustainability, circularity, fire safety and regulatory challenges are also highlighted areas of interest.
In addition to technical papers and posters, CPI is also accepting abstracts for panel discussions.
Further details and submission information are available via the conference website.